Inductance Modeling for On-chip Interconnects

نویسندگان

  • Shang-Wei Tu
  • Wen-Zen Shen
  • Yao-Wen Chang
  • Tai-Chen Chen
چکیده

As the operation frequency reaches gigahertz in deep-submicron designs, the effects of inductance on noise and delay can no longer be neglected. Most of the previous works on inductance extraction are fieldsolvers, which are intrinsically more accurate but computationally expensive. Others focus on modeling the inductances of special routing topologies such as the bus structure. Therefore, it is not suitable to incorporate them on-line into a layout (placement and routing) tool for inductance (delay and noise) optimization. In this paper, we consider the overlapping of unequal wire lengths and dimensions to efficiently extract the loop inductance from the coplanar interconnect structure. The difference between our simulation results and the estimation values obtained by FastHenry [12] is within 10% for practical cases. In particular, our method is very fast. Based on our study, we also suggest several routing topologies for inductance minimization.

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تاریخ انتشار 2001